2011-07-28 1 bcr555 1 2 3 pnp silicon digital transistor ? built in bias resistor ( r 1 = 2.2 k ? , r 2 = 10 k ? ) ? pb-free (rohs compliant) package ? qualified according aec q101 eha07183 3 2 1 c e b r 1 r 2 type marking pin configuration package bcr555 xds 1=b 2=e 3=c sot23 maximum ratings parameter symbol value unit collector-emitter voltage v ceo 50 v collector-base voltage v cbo 50 input forward voltage v i(fwd) 20 input reverse voltage v i(rev) 5 collector current i c 500 ma total power dissipation- t s 79 c p tot 330 mw junction temperature t j 150 c storage temperature t st g -65 ... 150 thermal resistance parameter symbol value unit junction - soldering point 1) r thjs 215 k/w 1 for calculation of r thja please refer to application note an077 (thermal resistance calculation)
2011-07-28 2 bcr555 electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dc characteristics collector-emitter breakdown voltage i c = 100 a, i b = 0 v (br)ceo 50 - - v collector-base breakdown voltage i c = 10 a, i e = 0 v (br)cbo 50 - - collector-base cutoff current v cb = 50 v, i e = 0 i cbo - - 100 na emitter-base cutoff current v eb = 5 v, i c = 0 i ebo - - 0.65 ma dc current gain- i c = 50 ma, v ce = 5 v h fe 70 - - - collector-emitter saturation voltage 1) i c = 50 ma, i b = 2.5 ma v cesat - - 0.3 v input off voltage i c = 100 a, v ce = 5 v v i(off) 0.4 - 1 input on voltage i c = 10 ma, v ce = 0.3 v v i(on) 0.5 - 1.4 input resistor r 1 1.5 2.2 2.9 k ? resistor ratio r 1 / r 2 0.19 0.22 0.24 - ac characteristics transition frequency i c = 50 ma, v ce = 5 v, f = 100 mhz f t - 150 - mhz 1 pulse test: t < 300s; d < 2%
2011-07-28 3 bcr555 dc current gain h fe = ? ( i c ) v ce = 5 v (common emitter configuration) 10 -4 10 -3 10 -2 10 -1 10 0 a i c -1 10 0 10 1 10 2 10 3 10 h fe -40 c -25 c 25 c 85 c 125 c collector-emitter saturation voltage v cesat = ? ( i c ), i c /i b = 20 10 -3 10 -2 10 -1 10 0 a i c 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 v 0.55 v cesat -40 c -25 c 25 c 85 c 125 c input off voltage v i(off) = ? ( i c ) v ce = 5v (common emitter configuration) 10 -5 10 -4 10 -3 10 -2 a i c -1 10 0 10 1 10 v v i(off) -40 c -25 c 25 c 85 c 125 c input on voltage v i (on) = ? ( i c ) v ce = 0.3v (common emitter configuration) 10 -4 10 -3 10 -2 10 -1 10 0 a i c -1 10 0 10 1 10 2 10 v v i(on) -40 c -25 c 25 c 85 c 125 c
2011-07-28 4 bcr555 total power dissipation p tot = ? ( t s ) 0 20 40 60 80 100 120 c 150 t s 0 50 100 150 200 250 300 mw 400 p tot permissible pulse load r thjs = ? ( t p ) 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 k/w r thjs 0.5 0.2 0.1 0.05 0.02 0.01 0.005 d = 0 permissible pulse load p totmax / p totdc = ? ( t p ) 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 3 10 4 10 - p totmax / p totdc d = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
2011-07-28 5 bcr555 package sot23 package outline foot print marking layout (example) standard packing reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel eh s bcw66 type code pin 1 0.8 0.9 0.9 1.3 0.8 1.2 0.25 m bc 1.9 -0.05 +0.1 0.4 0.1 2.9 0.95 c b 0...8? 0.2 a 0.1 max. 10? max. 0.08...0.15 1.3 0.1 10? max. m 2.4 0.15 0.1 1 a 0.15 min. 1) 1) lead width can be 0.6 max. in dambar area 12 3 3.15 4 2.65 2.13 0.9 8 0.2 1.15 pin 1 manufacturer 2005, june date code (ym)
2011-07-28 6 bcr555 edition 2009-11-16 published by infineon technologies ag 81726 munich, germany ? 2009 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
|
